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12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards

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ShenZhen KaiZhuo Electronic Technology Co.,Ltd

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12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards

Brand Name : KAZ

Model Number : PCB-S-HDI-001

Certification : ISO9001, UL, RoHS

Place of Origin : China

MOQ : 1

Price : 100

Supply Ability : 20000 sq.m / month

Delivery Time : 25~30

Packaging Details : vacuum

layers : 12

material : FR-4 Tg150

Min Line : 2 mil

PCB Type : HDI

Blind & Buried Via : Yes

Impedance Control : Yes

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This is a PCB with 12 layers, min line width and space is 2mil/2mil, specialty include impedance control, blind & buried via, BGA wtih soldmask defined,

Detials for this 12 layers min 2 mil line width high Tg High Density Interconnect HDI PCB:

12 layers
FR-4
Tg 150
ENIG surface
1.6mm board thickness
BGA with soldmask defined
With inpedance control
With Blind & buried via

Copper Thickness:

L1-------------------------------1/3OZ + Plating

PP 3.00mil

L2-------------------------------1/3OZ + Plating

PP 2.35mil

L5-------------------------------1/3OZ + Plating

PP 2.97mil

L6-------------------------------1/3OZ + Plating

PP 2.51mil

L5------------------------------H OZ

0.2mm Core

L6------------------------------H OZ

PP 2.75mil

L7-------------------------------H OZ

0.2mm Core

L8-------------------------------H OZ

PP 2.64mil

L9-------------------------------1/3OZ + Plating

PP 2.83mil

L10------------------------------1/3OZ + Plating

PP 2.43mil

L11------------------------------1/3OZ + Plating

PP 3.09mil

L12------------------------------1/3OZ + Plating

More photoes for this 12 layers HDI PCB

12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards

Product Tags:

blind via pcb

hdi pcb

12 Layers Min 2 Mil Line Width High TG High Density Interconnect HDI Printed Circuit Boards Images

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